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Researcher
Liping Zhang
- Disciplines:Condensed matter physics and nanophysics, Analytical chemistry, Pharmaceutical analysis and quality assurance, Inorganic chemistry, Organic chemistry, Physical chemistry
Affiliations
- Sustainable Chemistry for Metals and Molecules (Division)
Member
From25 Aug 2011 → 28 Feb 2017
Projects
1 - 1 of 1
- Innovative solutions for advanced interconnects using ultralow-k dielectricsFrom1 Mar 2013 → 7 Feb 2017Funding: Own budget, for example: patrimony, inscription fees, gifts
Publications
1 - 10 of 20
- Pore surface grafting of porous low-k dielectrics by selective polymers(2017)
Authors: Mikhail Krishtab, Liping Zhang
- Cu passivation for integration of gap-filling ultralow-k dielectrics(2016)
Authors: Liping Zhang, Stefan De Gendt
Pages: 232901 - 2329001 - Surface-confined activation of ultra low-k dielectrics in CO2 plasma(2016)
Authors: Yiting Sun, Mikhail Krishtab, Liping Zhang, Steven De Feyter
- Integration of porous low-k dielectrics using post porosity pore protection(2016)
Authors: Liping Zhang, Stefan De Gendt
Pages: 505105 - Mitigation of plasma-induced damage in porous low-k dielectrics by cryogenic precursor condensation(2016)
Authors: Liping Zhang, Stefan De Gendt
Pages: 1 - 13 - Damage free integration of ultralow-k dielectrics by template replacement approach(2015)
Authors: Liping Zhang, Stefan De Gendt
Pages: 092901 - Alternative integration of ultra low-k dielectrics by template replacement approach(2015)
Authors: Liping Zhang, Stefan De Gendt
Pages: 345 - 347Number of pages: 3 - Cryogenic etching processes applied to porous low-k materials using C4F8/SF6 plasmas(2015)
Authors: Liping Zhang
Pages: 435202 - Vacuum ultra-violet damage and damage mitigation for plasma processing of highly porous organosilicate glass dielectrics(2015)
Authors: Liping Zhang, Markus Heyne, Mikhail Krishtab
Pages: 133302 - Stuffing-enabled surface confinement of silanes used as sealing agents on CF4 plasma-exposed 2.0 p-OSG films(2015)
Authors: Yiting Sun, Liping Zhang, Johan Meersschaut, Steven De Feyter
Pages: 70 - 74
Patents
1 - 4 of 4
- Protection of porous substrates during plasma etching (Inventor)
- Method for producing an integrated circuit including a metallization layer comprising low k dielectric material (Inventor)
- Method for producing an integrated circuit including a metallization layer comprising low k dielectric material (Inventor)
- Plasma etching of porous substrates (Inventor)