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Researcher
Luka Kljucar
- Disciplines:Metallurgical engineering
Affiliations
- Structural Composites and Alloys, Integrity and Nondestructive Testing (SCALINT) (Division)
Member
From1 Aug 2020 → 26 Feb 2018 - Structural Composites and Alloys, Integrity and Nondestructive Testing (Division)
Member
From28 May 2012 → 26 Feb 2018 - Department of Materials Engineering (Department)
Member
From15 Jul 2011 → 31 Jan 2012
Projects
1 - 1 of 1
- Strength and Reliability Characterization of Multi-Level Back-End-of-Line under Chip Package Interaction LoadingFrom4 Mar 2013 → 12 Dec 2017Funding: Own budget, for example: patrimony, inscription fees, gifts
Publications
1 - 8 of 8
- Stress mitigation of 3D-stacking/packaging induced stresses(2018)
Authors: Luka Kljucar, Ingrid De Wolf
Pages: 4D.31 - 4D.36 - Strength and Reliability Characterization of Multi-Level Back-End-of-Line under Chip Package Interaction Loading(2017)
Authors: Luka Kljucar, Ingrid De Wolf, Martine Wevers
Number of pages: 187 - Study of GHz-SAM sensitivity to delamination in BEOL layers(2017)
Authors: Luka Kljucar, Ingrid De Wolf
Pages: 238 - 242 - Impact of via density on the mechanical integrity of advanced back-end-of-line during packaging(2016)
Authors: Luka Kljucar, Ingrid De Wolf
Pages: 1778 - 1785 - Evaluation of via density and low-k Young’s modulus influence on mechanical performance of advanced node multi-level Back-End-Of-Line(2016)
Authors: Luka Kljucar, Ingrid De Wolf
Pages: 93 - 100 - Effect of 4-point bending test procedure on crack propagation in thin film stacks(2015)
Authors: Luka Kljucar, Andrej Ivankovic, Ingrid De Wolf
Pages: 59 - 63 - Effect of 4-point bending test procedure on crack propagation in thin film stacks
Authors: Luka Kljucar, Mario Gonzalez, Kris Vanstreels, Andrej Ivankovic, Michael Hecker, Ingrid De Wolf
Pages: 59 - 63 - Impact of via density and passivation thickness on the mechanical integrity of advanced Back-End-Of-Line interconnects
Authors: Luka Kljucar, Ingrid De Wolf
Pages: 297 - 305