Researcher
Nivesh Mangal
- Disciplines:Scientific computing, Computer theory, Computer hardware, Other computer engineering, information technology and mathematical engineering, Electronics
Affiliations
- Department of Electronics and information systems (Department)
Member
From14 Jan 2015 → 20 Sep 2020
Publications
1 - 10 of 12
- Monolithic integration of microlenses on the backside of a silicon photonics chip for expanded beam coupling(2021)
Authors: Nivesh Mangal, Bradley Snyder, Joris Van Campenhout, Jeroen Missinne
Pages: 7601 - 7615 - Ball lens embedded through-package via to enable backside coupling between silicon photonics interposer and board-level interconnects(2020)
Authors: Nivesh Mangal, Jeroen Missinne, Joris Van Campenhout, Bradley Snyder
Pages: 2360 - 2369 - Alignment-tolerant coupling interfaces for board-level integration of silicon photonics(2020)
Authors: Nivesh Mangal
- Expanded-beam backside coupling interface for alignment-tolerant packaging of silicon photonics(2020)
Authors: Nivesh Mangal, Bradley Snyder, Joris Van Campenhout, Jeroen Missinne
- Performance evaluation of backside emitting O-Band grating couplers for 100 μm-thick silicon photonics interposers(2019)
Authors: Nivesh Mangal, Jeroen Missinne, Geert Van Steenberge, Joris Van Campenhout, Bradley Snyder
Pages: 1 - 1 - Alignment-tolerant interfacing of a photonic integrated circuit using back side etched silicon microlenses(2019)Volume: 10923
Authors: Jeroen Missinne, Nuria Teigell Beneitez, Nivesh Mangal, Jing Zhang, Anton Vasiliev, Joris Van Campenhout, Bradley Snyder, Günther Roelkens, Geert Van Steenberge, Graham T. Reed, et al.
Number of pages: 1 - Through-substrate coupling elements for silicon-photonics-based short-reach optical interconnects(2019)Volume: 10924
Authors: Nivesh Mangal, Jeroen Missinne, Joris Van Campenhout, Geert Van Steenberge, Bradley Snyder, Henning Schröder, Ray T. Chen
Number of pages: 1 - Integration of ball lens in through-package via to enable photonic chip-to-board coupling(2018)
Authors: Nivesh Mangal, Jeroen Missinne, Joris Van Campenhout, Geert Van Steenberge, Brad Snyder
Pages: 1140 - 1145 - Expanded-beam through-substrate coupling interface for alignment tolerant packaging of silicon photonics(2018)
Authors: Nivesh Mangal, Jeroen Missinne, Günther Roelkens, B. Snyder
Number of pages: 1 - Packaging and assembly challenges for 50G silicon photonics interposers(2018)
Authors: Bradley Snyder, Nivesh Mangal, Guy Lepage, Sadhishkumar Balakrishnan, Xiao Sun, Nicolas Pantano, Michal Rakowski, Lieve Bogaerts, Peter De Heyn, Peter Verheyen, et al.
Number of pages: 1