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Researcher
Chukwudi Okoro
- Disciplines:Control systems, robotics and automation, Design theories and methods, Mechatronics and robotics, Computer theory, Manufacturing engineering, Other mechanical and manufacturing engineering, Product development
Affiliations
- Production Engineering, Machine Design and Automation (PMA) Section (Division)
Member
From1 Apr 2006 → 30 Sep 2010
Publications
1 - 9 of 9
- A novel Cu-Cu bonding technique: the insertion bonding approach(2011)
Authors: Chukwudi Okoro, Dirk Vandepitte
Pages: 1885 - 1894 - Polymer filling of silicon trenches for 3D through silicon vias applications(2011)
Authors: Chukwudi Okoro
Pages: 825 - 832 - Influence of annealing conditions on the mechanical and microstructural behavior of electroplated Cu-TSV(2010)
Authors: Chukwudi Okoro, Bert Verlinden, Dirk Vandepitte
Pages: 1 - 6 - Test structures for characterization of thermal-mechanical stress in 3D stacked IC for analog design(2010)
Authors: Yu Yang, Chukwudi Okoro, Michal Rakowski
Pages: 140 - 144 - Impact of thinning and through silicon via proximity on high-k / metal gate first CMOS performance(2010)
Authors: Yu Yang, Guruprasad Katti, Chukwudi Okoro, Panagiotis Asimakopoulos, Ingrid De Wolf
Pages: 109 - 110 - Elimination of the axial deformation problem of Cu-TSV in 3D integration(2010)
Authors: Chukwudi Okoro, Dirk Vandepitte
Pages: 214 - 220 - Insertion bonding: A novel Cu-Cu bonding approach for 3D integration(2010)
Authors: Chukwudi Okoro, Dirk Vandepitte
Pages: 1370 - 1375 - Comprehensive analysis of the impact of single and arrays of through silicon vias induced stress on high-k / metal gate CMOS performances
Authors: Ingrid De Wolf, Panagiotis Asimakopoulos, Chukwudi Okoro, Yu Yang
Pages: 26 - 29 - Extraction of the appropriate material property for realistic modeling of through-Silicon-vias using ยต-Raman spectroscopy
Authors: Chukwudi Okoro, Yu Yang, Dirk Vandepitte, Bert Verlinden, Ingrid De Wolf
Pages: 16 - 18