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Publication
Polymer filling of silicon trenches for 3D through silicon vias applications
Journal Contribution - Journal Article
Journal: IEEE Transactions on Components, Packaging and Manufacturing Technology
ISSN: 2156-3950
Issue: 6
Volume: 1
Pages: 825 - 832
Publication year:2011
BOF-keylabel:yes
IOF-keylabel:yes
BOF-publication weight:1
CSS-citation score:2
Authors from:Higher Education