< Back to previous pagePublication Wafer-Level Parylene Temporary Packaging Technology for MEMS Applications Book Contribution - Book Chapter Conference ContributionBook: Eurosensors XXV Pages: 1501 - 1504Publication year:2011Institutional Repository URL: https://lirias.kuleuven.be/1733201Authors/publisherL Wen (First author)K Wouters (Author)Frederik Ceyssens (Author)Ann Witvrouw (Author)Robert Puers (Last author)Research unitsMembrane Separations, Adsorption, Catalysis, and Spectroscopy for Sustainable Solutions (cMACS)(Division)KU LeuvenManufacturing Processes and Systems (MaPS)(Division)KU LeuvenElectronic Circuits and Systems (ECS)(Division)KU LeuvenEventsEurosensors XXV()Athens, Greece
