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Publication

Experimental Validation of Process-Induced Variability Aware SPICE Simulation Platform for Sub-20 nm FinFET Technologies

Journal Contribution - Journal Article

Journal: IEEE Transactions on Electron Devices
ISSN: 0018-9383
Issue: 3
Volume: 68
Pages: 976 - 980
Publication year:2021
BOF-keylabel:yes
IOF-keylabel:yes
BOF-publication weight:1
CSS-citation score:2
Authors:International
Authors from:Government, Higher Education
Accessibility:Closed