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Publication
Hot-Electron-Induced Punch-Through (HEIP) Effect in p-MOSFET Enhanced by Mechanical Stress
Journal Contribution - Journal Article
Journal: IEEE Electron Device Letters
ISSN: 0741-3106
Issue: 10
Volume: 42
Pages: 1424 - 1427
Publication year:2021
BOF-keylabel:yes
IOF-keylabel:yes
BOF-publication weight:1
CSS-citation score:1
Authors from:Government, Higher Education
Accessibility:Closed