Characterization of IMC (intermetallic compound) properties used at 3D stacking high density interconnects

The third dimension, or vertical dimension, of integrated circuits, attracted more interest in the recent years since it allows achieving device density multiplication by stacking IC layers in the third dimension. To increase the functional density and obtain higher computing performance, the interconnects used in 3D integration, such as TSVs and microbumps, must be reduced in size in a reliable way. The decrease of the interconnect size and increase of the interconnect density can bring new challenges for process integration and reliability. The motivation and challenges for the development of miniaturized solder joints will be examined.