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Publication

Area-Selective Electroless Deposition of Cu for Hybrid Bonding

Journal Contribution - Journal Article

Journal: IEEE Electron Device Letters

ISSN: 0741-3106

Issue: 12

Volume: 42

Pages: 1826 - 1829

Publication year:2021

DOI: https://doi.org/10.1109/led.2021.3124960
Institutional Repository URL: https://lirias.kuleuven.be/3651349