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Patent

Transfer of two-dimensional layers

A method for delaminating a film from a substrate. The method comprises: providing (210) a substrate (101) of a first material with on top thereof a film (102) of a second material; bonding (220) the film (102) to a carrier (108) using an adhesive (106); intercalating (230) a supercritical fluid between the film (102) and the substrate (101), wherein the supercritical fluid has a critical temperature below a glass transition temperature of the adhesive (106); mechanical peeling (240) of the substrate (101) from the film (102).
Patent Publication Number: EP3624170
Year filing: 2021
Year approval: 2021
Year publication: 2021
Status: Assigned
Technology domains: Semiconductors
Validated for IOF-key: Yes
Attributed to: Associatie KULeuven