< Back to previous page
Project
Platform for Advanced 3D-Stacked Image Sensors (3SIS)
The goal of this project is to develop a generic platform consisting of both process technology modules as well as design techniques to enable a multitude of future silicon-based image sensor applications.
Date:1 Jan 2010 → 31 Dec 2013
Keywords:3D-Stacked Image Sensors
Disciplines:Theory and methodology of archaeology