Fabrication technique of a compressible biocompatible interconnect using a thin film transfer process

A compressible multifunctional interconnect for out-of-plane MEMS structures has been fabricated using a thin film transfer bonding technique and bio-tolerable materials. The bulk material of the stretchable film consists of photo-patternable poly-dimethylsiloxane and is fabricated on a carrier substrate. The film is bonded to a slim-base platform. The carrier substrate of the thin film is released using an aluminum anodic dissolution technique. Probe arrays can be assembled perpendicularly into a slim-base platform. Once the probes are assembled a non-separable electrical connection is established. © 2011 IOP Publishing Ltd.

Publication year:2011

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IOF-keylabel:yes

BOF-publication weight:1

CSS-citation score:1

Authors:International

Authors from:Government, Higher Education