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Researcher
Ingrid De Wolf
- Disciplines:Metallurgical engineering
Affiliations
- Structural Composites and Alloys, Integrity and Nondestructive Testing (SCALINT) (Division)
Member
From1 Aug 2020 → Today - Structural Composites and Alloys, Integrity and Nondestructive Testing (Division)
Member
From1 Jan 2012 → 31 Jul 2020 - Department of Materials Engineering (Department)
Member
From1 Oct 2007 → 31 Dec 2011
Projects
1 - 10 of 29
- Developing Tip-Enhanced Raman Spectroscopy for advanced nanoelectronicsFrom1 Mar 2022 → TodayFunding: Own budget, for example: patrimony, inscription fees, gifts
- Design-Technology Co-optimization techniques for enablement of MRAM-based Machine Learning hardwareFrom18 Feb 2022 → 31 May 2022Funding: Own budget, for example: patrimony, inscription fees, gifts
- Characterization of IMC (intermetallic compound) properties used at 3D stacking high density interconnectsFrom21 Jan 2022 → TodayFunding: Own budget, for example: patrimony, inscription fees, gifts
- Machine learning opportunities for reliability researchFrom23 Dec 2021 → TodayFunding: Own budget, for example: patrimony, inscription fees, gifts
- Electron-beam based nanoprobing for failure and defect analysis of sub-10 nm node semiconductor devicesFrom23 Dec 2021 → TodayFunding: Own budget, for example: patrimony, inscription fees, gifts
- Investigation of void dynamics in metal interconnects under electrical mechanical thermal stimuli using physics based models augmented by machine learningFrom22 Nov 2021 → TodayFunding: Own budget, for example: patrimony, inscription fees, gifts
- Reliability of Monolithic Integrated III-V Laser DevicesFrom22 Sep 2021 → TodayFunding: Own budget, for example: patrimony, inscription fees, gifts
- Reliability of thin-film IGZO transistors for logic and memory applicationsFrom22 Sep 2021 → TodayFunding: FWO Strategic Basic Research Grant
- Understanding defect generation/recombination processes in Ge-on-Si photodetectorsFrom22 Sep 2021 → TodayFunding: Own budget, for example: patrimony, inscription fees, gifts
- Active coolant flow control for energy-efficient integrated package level micro-jet coolingFrom7 Jun 2021 → TodayFunding: Own budget, for example: patrimony, inscription fees, gifts
Publications
21 - 30 of 307
- Optical Beam-Based Defect Localization Methodologies for Open and Short Failures in Micrometer-Scale 3-D TSV Interconnects(2020)
Authors: Ingrid De Wolf
Pages: 1542 - 1551 - Low-frequency noise and thermal equilibrium properties of vacancies(2020)
Authors: Ingrid De Wolf
- A Novel Intermetallic Compound Insertion Bonding to Improve Throughput for Sequential 3-D Stacking(2020)
Authors: Lin Hou, Ingrid De Wolf
Pages: 669 - 678 - Nanoindentation Methodologies for Characterizing Thin (Porous) Low Dielectric Constant Materials and Copper Pads(2020)
Authors: Oguzhan Orkut Okudur, Ingrid De Wolf, Martine Wevers
- On the impact of mechanical stress on gate oxide trapping(2020)
Authors: Anastasiia Kruv, Ingrid De Wolf
Number of pages: 5 - Process development and characterization of 3D multi-die stacking(2020)
Authors: Ingrid De Wolf
Number of pages: 6 - A Novel Resistance Measurement Methodology for In Situ UBM/Solder Interfacial Reaction Monitoring(2020)
Authors: Lin Hou, Ingrid De Wolf
Pages: 30 - 38 - Exploration of GHz-Scanning Acoustic Microscopy for Failure Analysis of Innovative Silicon Technologies(2019)
Authors: Ahmad Elsayed Esam Khaled, Ingrid De Wolf, Martine Wevers
- Electromigration Activation Energies in Alternative Metal Interconnects(2019)
Authors: Sofie Beyne, Herman Oprins, Ingrid De Wolf
Pages: 5278 - 5283 - Effects of isothermal storage on grain structure of Cu/Sn/Cu microbump interconnects for 3D stacking(2019)
Authors: Ingrid De Wolf
Patents
1 - 9 of 9
- Method for the electrical bonding of semiconductor components (Inventor)
- A method for the electrical bonding of semiconductor components (Inventor)
- Method of detecting manufacturing defects by thermal stimulation (Inventor)
- Method for aligning micro-electronic components using an alignment liquid and electrostatic alignment as well as corresponding assembly of aligned micro-electronic components (Inventor)
- Method for aligning micro-electronic components (Inventor)
- Method for aligning micro-electronic components (Inventor)
- Method for producing an integrated circuit device with enhanced mechanical properties (Inventor)
- Lock in thermal laser stimulation through one side of the device while acquiring lock-in thermal emission images on the opposite side (Inventor)
- Lock in thermal laser stimulation through one side of the device while acquiring lock-in thermal emission images on the opposite side (Inventor)