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Researcher
Ingrid De Wolf
- Disciplines:Metallurgical engineering
Affiliations
- Structural Composites and Alloys, Integrity and Nondestructive Testing (SCALINT) (Division)
Member
From1 Aug 2020 → Today - Structural Composites and Alloys, Integrity and Nondestructive Testing (Division)
Member
From1 Jan 2012 → 31 Jul 2020 - Department of Materials Engineering (Department)
Member
From1 Oct 2007 → 31 Dec 2011
Projects
11 - 20 of 29
- Study of the impact of thermal gradients on the reliability of metals used in micro-electronicsFrom2 Jun 2021 → TodayFunding: Own budget, for example: patrimony, inscription fees, gifts
- Ultrathin Ferroelectric complex oxidesFrom8 Feb 2021 → TodayFunding: Own budget, for example: patrimony, inscription fees, gifts
- Integrated GHz Scanning Acoustic Microscope for 3D nano-imagingFrom6 Nov 2020 → 14 Jul 2023Funding: Own budget, for example: patrimony, inscription fees, gifts
- Thermal Management of Integrated CMOS-Si Photonics Optical TransceiversFrom18 Aug 2020 → 9 Nov 2023Funding: Own budget, for example: patrimony, inscription fees, gifts
- Mechanical strength characterization of nanoscale materialFrom2 Jul 2020 → 5 Jul 2022Funding: Own budget, for example: patrimony, inscription fees, gifts
- Fundamental and practical aspects of gate oxide breakdown in VLSI technologiesFrom4 Dec 2019 → 4 Dec 2023Funding: Own budget, for example: patrimony, inscription fees, gifts
- Alternative metals and nanowires for advanced interconnect applicationsFrom28 Aug 2018 → 31 Oct 2023Funding: FWO Strategic Basic Research Grant
- Nano-focused Raman spectroscopy for stress and compositional metrologyFrom31 Jul 2018 → 31 Jul 2022Funding: Own budget, for example: patrimony, inscription fees, gifts
- The KU Leuven X-ray computed tomography centre: a versatile and structured way to unravel the material structures and dynamic processes.From1 May 2018 → 30 Apr 2022Funding: FWO Large scale research infrastructure
- Fundamental Understanding and Characterization of Direct bonding and Hybrid bonding TechnologiesFrom26 Mar 2018 → 25 May 2023Funding: Own budget, for example: patrimony, inscription fees, gifts
Publications
1 - 10 of 307
- A framework for combined simulations of electromigration induced stress evolution, void nucleation, and its dynamics: Application to nano-interconnect reliability(2023)
Authors: Ingrid De Wolf
- Electro-Absorption Modulator Thermo-Optical Self-Heating Analysis(2023)
Authors: Ingrid De Wolf
Pages: 6000 - 6006 - Degradation Mapping and Impact of Device Dimension on IGZO TFTs BTI(2023)
Authors: Ingrid De Wolf
Pages: 337 - 345 - Advanced Current-Voltage Model of Electrical Contacts to GaAs- and Ge-Based Active Silicon Photonic Devices(2023)
Authors: Ping-Yi Hsieh, Ingrid De Wolf
Pages: 4274 - 4279 - Impact of via geometry and line extension on via-electromigration in nano-interconnects(2023)
Authors: Ingrid De Wolf
Number of pages: 4 - Thermomigration-induced void formation in Cu-interconnects - Assessment of main physical parameters(2023)
Authors: Ingrid De Wolf
Number of pages: 7 - Analysis of TDDB lifetime projection in low thermal budget HfO2/SiO2 stacks for sequential 3D integrations(2023)
Authors: Andrea Vici, Ingrid De Wolf
Number of pages: 7 - Simulation of Cu pad expansion in wafer-to-wafer Cu/SiCN hybrid bonding(2022)
Authors: Marc Seefeldt, Ingrid De Wolf
- Impact of Externally Induced Local Mechanical Stress on Electrical Performance of Decananometer MOSFETs(2022)
Authors: Ingrid De Wolf
Pages: 5382 - 5385 - Properties of ultrathin molybdenum films for interconnect applications(2022)
Authors: Johan Meersschaut, Joris Van de Vondel, Ingrid De Wolf
Patents
1 - 9 of 9
- Method for the electrical bonding of semiconductor components (Inventor)
- A method for the electrical bonding of semiconductor components (Inventor)
- Method of detecting manufacturing defects by thermal stimulation (Inventor)
- Method for aligning micro-electronic components using an alignment liquid and electrostatic alignment as well as corresponding assembly of aligned micro-electronic components (Inventor)
- Method for aligning micro-electronic components (Inventor)
- Method for aligning micro-electronic components (Inventor)
- Method for producing an integrated circuit device with enhanced mechanical properties (Inventor)
- Lock in thermal laser stimulation through one side of the device while acquiring lock-in thermal emission images on the opposite side (Inventor)
- Lock in thermal laser stimulation through one side of the device while acquiring lock-in thermal emission images on the opposite side (Inventor)