Interaction of CMP, surface preparation, and material properties on hybrid bonding for 3D integration KU Leuven
Over the past few decades, 3D integration has developed as a field in which multiple dies are stacked and electrically connected. Traditionally, microbumps have been used as a method to increase interconnect densities, enabling the pitch to scale down to a few microns. However, further scaling is challenging, e.g. due to mechanical stability which becomes problematic at small bump diameters and the impact of Kirkendall voids on the electrical ...