Development of Microvalves for High-Performance Cooling of Microelectronics KU Leuven
Driven by miniaturization and the continuing increase in clock speed and data transfer, power dissipation in many electronic components has exceeded the limits of conventional cooling methodologies, such as fan-blown air cooling. Given the expected increase in power density, microprocessor designers have identified cooling as one of the major challenges forthe next decade. Similar needs arise from the further development of other electronic ...