Projects
ORGANIC: Opportunities for Research towards GAllium-Nitride Integrated Circuits KU Leuven
Spray coating as an enabler for heterogeneous semiconductor systems-on-chip & bioelectronics Ghent University
The goal of this project is to develop the spray coating of photoresist, ultra-thin DVS-BCB adhesive bonding layers and other advanced polymers on 200 mm Si wafers or small samples comprising photonic or electronic integrated circuits (ICs), or MEMS. This will enable the realization of heterogeneous semiconductor systems-on-chip for application in optical transceivers, smart sensors and advanced electronic integrated circuits (analogue ...
DECIBUS - DEmonstration of Communication In the Body by UltraSound KU Leuven
Smart Hybrid DC-DC converters for Li-ion Battery Operated Portable Electronics KU Leuven
The goal of this dissertation is to develop power management integrated circuits (PMICs) for Li-ion battery-operated portable electronics that are lightweight, affordable, and efficient. On the one hand, a limited energy source, such as a small battery, mandates efficient use of energy to extend battery life. Emerging applications like internet-of-things (IoTs), on the other hand, push for incredibly smaller footprints. The traditional method ...
Design and implementation of photonic-enabled large-scale active antenna systems for fifth-generation wireless communication systems and beyond Ghent University
The current 4G system already exploits the available bandwidth optimally. The stringent demands of the 5G wireless communication system, the Internet-of-Things and future aerospace applications require either larger bandwidths, only available at mm-wave frequencies, or the deployment of multi-antenna systems at a massive scale. We propose an innovative generic design
procedure for the pervasive integration and implementation of ...
Photonic interconnect layer on silicon / Ultra low power Photonic Ics for optical interconnects sand communication networks Ghent University
Future high performance microprocessors will be confronted with a bottleneck on the datacommunication level: classical electrical interconnects will no longer suffice. To overcome this, this project will investigate an optical interconnect layer for on-chip communication. The most important component in the source, a nanolaser with minimal power consumption.
- We aim the developing new device concepts for micro-lasers, detectors, ...