Improved Models for Thermal Fluid Topology Optimization KU Leuven
Thermal-fluid cooling systems are commonly used in many industrial applications due to their capability to handle high heat loads. An example is the cooling of electronic devices. For the new generations of processors, the continuously increasing power density is a bottleneck in guaranteeing their functional performance. This poses serious challenges to the cooling system design. To optimize the performance of these liquid-cooled heat sinks ...