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Onderzoeker
Guruprasad Katti
- Disciplines:Nanotechnologie, Ontwerptheorieën en -methoden
Affiliaties
- Geassocieerde Afdeling ESAT - INSYS (INSYS), Integrated Systems (Afdeling)
Lid
Vanaf1 aug 2020 → 31 mei 2011 - Geassocieerde Afdeling ESAT - INSYS, Integrated Systems (Afdeling)
Lid
Vanaf15 mrt 2011 → 31 mei 2011 - Departement Elektrotechniek (ESAT) (Departement)
Lid
Vanaf8 jan 2007 → 14 mrt 2011
Publicaties
1 - 10 van 12
- Test structures for characterization of through-silicon vias(2012)
Auteurs: Guruprasad Katti, Wim Dehaene
Pagina's: 355 - 364 - Technology assessment of through-silicon via by using C-V and C-t Measurements(2011)
Auteurs: Guruprasad Katti, Kristin De Meyer, Wim Dehaene
Pagina's: 946 - 948 - Temperature-dependent modeling and characterization of Through Silicon Via (TSV) capacitance(2011)
Auteurs: Guruprasad Katti, Kristin De Meyer, Wim Dehaene
Pagina's: 563 - 565 - TSV characterization and modeling(2011)
Auteurs: Guruprasad Katti
Pagina's: 33 - 49Aantal pagina's: 17 - Design issues and considerations for low-cost 3-D TSV IC technology(2011)
Auteurs: Guruprasad Katti, Ingrid De Wolf, Michal Rakowski, Wim Dehaene
Pagina's: 293 - 307 - Impact of thinning and through silicon via proximity on high-k / metal gate first CMOS performance(2010)
Auteurs: Yu Yang, Guruprasad Katti, Chukwudi Okoro, Panagiotis Asimakopoulos, Ingrid De Wolf
Pagina's: 109 - 110 - Test structures for characterization of through silicon vias(2010)
Auteurs: Guruprasad Katti, Wim Dehaene
Pagina's: 130 - 134 - Electrical modeling and characterization of through silicon via for three-dimensional ICs(2010)
Auteurs: Guruprasad Katti, Kristin De Meyer, Wim Dehaene
Pagina's: 256 - 262 - 3D stacked ICs using Cu TSVs and die to wafer hybrid collective bonding(2009)
Auteurs: Guruprasad Katti, Kristin De Meyer
Pagina's: 331 - 334 - 3D Stacked IC demonstrator using hybrid collective Die-to-Wafer bonding with copper through silicon vias (TSV)
Auteurs: Wim Dehaene, Kristin De Meyer, Guruprasad Katti
Pagina's: 1 - 5