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Onderzoeker
Liping Zhang
- Disciplines:Fysica van gecondenseerde materie en nanofysica, Analytische chemie, Farmaceutische analyse en kwaliteitszorg, Anorganische chemie, Organische chemie, Fysische chemie
Affiliaties
- Duurzame Chemie voor Metalen en Moleculen (Afdeling)
Lid
Vanaf25 aug 2011 → 28 feb 2017
Projecten
1 - 1 of 1
- Innovative solutions for advanced interconnects using ultralow-k dielectricsVanaf1 mrt 2013 → 7 feb 2017Financiering: Eigen Middelen zoals patrimonium, inschrijvingsgelden, giften, ....
Publicaties
1 - 10 van 20
- Pore surface grafting of porous low-k dielectrics by selective polymers(2017)
Auteurs: Mikhail Krishtab, Liping Zhang
- Cu passivation for integration of gap-filling ultralow-k dielectrics(2016)
Auteurs: Liping Zhang, Stefan De Gendt
Pagina's: 232901 - 2329001 - Surface-confined activation of ultra low-k dielectrics in CO2 plasma(2016)
Auteurs: Yiting Sun, Mikhail Krishtab, Liping Zhang, Steven De Feyter
- Integration of porous low-k dielectrics using post porosity pore protection(2016)
Auteurs: Liping Zhang, Stefan De Gendt
Pagina's: 505105 - Mitigation of plasma-induced damage in porous low-k dielectrics by cryogenic precursor condensation(2016)
Auteurs: Liping Zhang, Stefan De Gendt
Pagina's: 1 - 13 - Damage free integration of ultralow-k dielectrics by template replacement approach(2015)
Auteurs: Liping Zhang, Stefan De Gendt
Pagina's: 092901 - Alternative integration of ultra low-k dielectrics by template replacement approach(2015)
Auteurs: Liping Zhang, Stefan De Gendt
Pagina's: 345 - 347Aantal pagina's: 3 - Cryogenic etching processes applied to porous low-k materials using C4F8/SF6 plasmas(2015)
Auteurs: Liping Zhang
Pagina's: 435202 - Vacuum ultra-violet damage and damage mitigation for plasma processing of highly porous organosilicate glass dielectrics(2015)
Auteurs: Liping Zhang, Markus Heyne, Mikhail Krishtab
Pagina's: 133302 - Stuffing-enabled surface confinement of silanes used as sealing agents on CF4 plasma-exposed 2.0 p-OSG films(2015)
Auteurs: Yiting Sun, Liping Zhang, Johan Meersschaut, Steven De Feyter
Pagina's: 70 - 74
Patenten
1 - 4 van 4
- Protection of porous substrates during plasma etching (Inventor)
- Method for producing an integrated circuit including a metallization layer comprising low k dielectric material (Inventor)
- Method for producing an integrated circuit including a metallization layer comprising low k dielectric material (Inventor)
- Plasma etching of porous substrates (Inventor)