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Onderzoeker
Liping Zhang
- Disciplines:Fysica van gecondenseerde materie en nanofysica, Analytische chemie, Farmaceutische analyse en kwaliteitszorg, Anorganische chemie, Organische chemie, Fysische chemie
Affiliaties
- Duurzame Chemie voor Metalen en Moleculen (Afdeling)
Lid
Vanaf25 aug 2011 → 28 feb 2017
Projecten
1 - 1 of 1
- Innovative solutions for advanced interconnects using ultralow-k dielectricsVanaf1 mrt 2013 → 7 feb 2017Financiering: Eigen Middelen zoals patrimonium, inschrijvingsgelden, giften, ....
Publicaties
11 - 20 van 20
- Improved Plasma Resistance for Porous Low-k Dielectrics by Pore Stuffing Approach(2015)
Auteurs: Liping Zhang, Markus Heyne, Yiting Sun, Stefan De Gendt
Pagina's: N3098 - N3107 - Optimized pore stuffing for enhanced compatibility with interconnect integration flow(2015)
Auteurs: Liping Zhang
Pagina's: 91 - 94 - Quantitative characterization of pore stuffing and unstuffing for postporosity plasma protection of low-k materials(2014)
Auteurs: Markus Heyne, Liping Zhang, Stefan De Gendt
Pagina's: 0622021 - 06220210 - Cryogenic etching reduces plasma-induced damage of ultralow-k dielectrics(2014)
Auteurs: Liping Zhang
Pagina's: 25 - 27 - Metal-organic framework ZIF-8 films as low-k dielectrics in microelectronics(2013)
Auteurs: S Eslava, Liping Zhang, S Esconjauregui, J Yang, Kris Vanstreels, Mikhaïl Baklanov, E Saiz
Pagina's: 27 - 33 - Damage free cryogenic etch of ultra low-k materials: recent experimental results and theoretical analysis(2013)
Auteurs: Liping Zhang
Pagina's: 51 - 53 - Metal-organic framework ZIF-8 films as low-k dielectrics in microelectronics(2013)
Auteurs: Liping Zhang
Pagina's: 27 - 33 - Damage free cryogenic etching of a porous organosilica ultralow-k film(2013)
Auteurs: Liping Zhang, Stefan De Gendt
Pagina's: N5 - N7 - Low damage cryogenic etching of porous organosilicate low-k materials using SF6/O2/SiF4(2013)
Auteurs: Liping Zhang, Stefan De Gendt
Pagina's: N131 - N139 - Impact of curing condition on chemical stability of ultralow-k PMO material(2012)
Auteurs: Mikhail Krishtab, Liping Zhang
Pagina's: 7 - 12
Patenten
1 - 4 van 4
- Protection of porous substrates during plasma etching (Inventor)
- Method for producing an integrated circuit including a metallization layer comprising low k dielectric material (Inventor)
- Method for producing an integrated circuit including a metallization layer comprising low k dielectric material (Inventor)
- Plasma etching of porous substrates (Inventor)