< Terug naar vorige pagina
Onderzoeker
Vikas Dubey
- Disciplines:Metallurgie
Affiliaties
- Structurele Materialen (SCALINT) (Afdeling)
Lid
Vanaf1 aug 2020 → 30 nov 2017 - Geassocieerde Afdeling ESAT - INSYS (INSYS), Integrated Systems (Afdeling)
Lid
Vanaf1 aug 2020 → 31 aug 2012 - Departement Materiaalkunde (Departement)
Lid
Vanaf18 nov 2013 → 17 nov 2016 - Structurele Materialen (Afdeling)
Lid
Vanaf1 sep 2012 → 30 nov 2017
Projecten
1 - 1 of 1
- Fijne hoge-densiteit 3D integratie met behulp van zelf-alignerende assemblageVanaf2 jul 2012 → 20 nov 2017Financiering: Eigen Middelen zoals patrimonium, inschrijvingsgelden, giften, ....
Publicaties
1 - 10 van 10
- Physics of self-aligned assembly at room temperature(2018)
Auteurs: Vikas Dubey, Ingrid De Wolf
- On the feasibility of die-to-wafer inorganic dielectric bonding(2016)
Auteurs: Teng Wang, Arnita Podpod, Giovanni Capuz, Lan Peng, Alain Phommahaxay, Fumihiro Inoue, Pieter Bex, Vikas Dubey, Kenneth June Rebibis, Andy Miller, et al.
Aantal pagina's: 5 - Liquid mediated direct bonding and bond propagation(2016)
Auteurs: Vikas Dubey, Kherim Willems, Ingrid De Wolf
Aantal pagina's: 4 - Surface treatment to enable low temperature and pressure copper direct bonding(2016)
Auteurs: Vikas Dubey, Ingrid De Wolf
Pagina's: 2435 - 2441 - Fine pitch rapid heat self-aligned assembly and liquid-mediated direct bonding of Si chips(2016)
Auteurs: Vikas Dubey, Jean-Pierre Celis, Ingrid De Wolf
Pagina's: 946 - 953 - 3D stacking using bump-less process for sub 10 µm pitches(2016)
Auteurs: Lin Hou, Vikas Dubey
Pagina's: 128 - 133 - Room temperature and zero pressure high quality oxide direct bonding for 3D self-aligned assembly(2014)
Auteurs: Vikas Dubey, Ingrid De Wolf, Jean-Pierre Celis
Pagina's: 579 - 582 - 3D thermal model with high spatial and temporal resolution(2012)
Auteurs: Vikas Dubey, Francky Catthoor, Urmimala Chatterjee, Buvana Lefevre, Kris Baert
Pagina's: 1339 - 1342 - Effect of surface treatment to enable low temperature and pressure copper direct bonding
Auteurs: Vikas Dubey, Ingrid De Wolf
Pagina's: 2435 - 2441 - Fine Pitch 3D-Integration Using Self-Aligned Assembly
Auteurs: Vikas Dubey, Ingrid De Wolf, Jean-Pierre Celis
Patenten
1 - 8 van 8
- Method for bonding semiconductor chips to a landing wafer (Inventor)
- Simulation of photovoltaic modules (Inventor)
- Method for aligning micro-electronic components using an alignment liquid and electrostatic alignment as well as corresponding assembly of aligned micro-electronic components (Inventor)
- Method for self-aligned solder reflow bonding and devices obtained thereof (Inventor)
- Simulation of photovoltaic modules (Inventor)
- Method for self-aligned solder reflow bonding and devices obtained therefrom (Inventor)
- Method for aligning micro-electronic components (Inventor)
- Method for aligning micro-electronic components (Inventor)