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Study of the interfacial reactions controlling the spreading of Al on Ni

Tijdschriftbijdrage - Tijdschriftartikel

Despite the importance in high-temperature processing, wettability studies focusing on liquid aluminum (Al) on solid nickel (Ni) at high temperatures are scarce due to the difficulty of performing experiments and the complexity of interfacial physical and chemical activities. The effects of interrelated multi-factors, including intermetallic compounds (IMCs) formation and diffusion on wetting dynamics is still debatable. Therefore, in this study, we investigated the reactive spreading of liquid Al on solid Ni by using the combined pendant/sessile drop method between 750 and 950 °C. The effects of Ni dissolution into Al on the spreading dynamics were limited due to the low Ni solubility below 950 °C. Two continuous Al-rich IMC layers, Al3Ni and Al3Ni2 layers formed at the Al/Ni interface during the isothermal holding stage and affect the final wetting behavior. Additional capillary quenching experiments confirmed that the Al3Ni phase was the first formed phase. At equilibrium, the Al3Ni layer was pinned at the triple-phase line at 750 °C while it can spread ahead of the liquid front at higher temperatures. This process may be the main reason why at higher temperatures a better spreading is observed as the Al3Ni layer has a larger affinity to Al than the pure Ni substrate.
Tijdschrift: Applied Surface Science
ISSN: 0169-4332
Volume: 571
Jaar van publicatie:2022
Toegankelijkheid:Open