Influence of process parameters on low current resistive switching in MOCVD and ALD NiO Films KU Leuven
The unipolar resisitive switching properties of MOCVD deposited NiO in Ni/NiO/TiN stacks is reported. The switching quality is defined as function of RESET current and Roff/Ron ratio, and the importance of the Forming current and voltage on these parameters is discussed. The effect of structural stack variations as NiO thickness, Ti doping, and TiN thickness on the switching behavior of NiO is explained by the effect on the forming current and ...