Templated DSA vias in sub-7 nm circuits: Design strategy and DSA-aware via decomposition KU Leuven
Directed self-assembly (DSA) of block co-polymers (BCP) is a promising candidate for frequency multiplication below 20nm half-pitch. In this study we will focus on the generation of holes using cylindrical phase BCP materials. This is done by means of grapho-epitaxy where physical confinement is used. Conventional lithography (ArF or EUV) is used to create a pre-pattern. After surface energy modification, the BCP is deposited in the ...