Development of B-spline x-ray diffraction imaging techniques for die warpage and stress monitoring inside fully encapsulated packaged chips KU Leuven
© 2014 IEEE. Advanced packaging is a key 'More than Moore' (MtM) enabling technology [1]. In all of these advanced packaging processes the semiconductor die are becoming much thinner (e.g. 25-50 μm thick) and many packages include multiply stacked silicon die. This leads to very thin packages where there is a trade-off between the thickness of constituent package layers and their rigidity, thus leading to reliability problems. Currently there ...