The Shear Test as Interface Characterization Tool Applied to the Si-BCB Interface KU Leuven
Electronic packages are multimaterial structures. Their reliability is a major concern for the electronic industry and therefore widely studied. Apart from the electrical performance, the mechanical stability also needs attention. A dreaded failure cause is delami-nation. Therefore it is interesting to have a modeling tool, which can provide information on possible delamination risks. In this paper, a short overview of existing appropriate ...