Infrastructure

High-intensity UV light source primarily used for curing UV-sensitive adhesives in liquid crystal device assembly, suitable for any application requiring focused UV illumination.

Automated vacuum lamination press with controlled temperature and pressure profiles for 330 mm by 280 mm substrates.

Ultrafast laser micromachining system for high-precision structuring, cutting, drilling, and welding on diverse materials. Equipped with femtosecond and picosecond lasers across multiple wavelengths (355–1064 nm), enabling minimal heat-affected zones and high energy confinement for delicate and complex processing tasks.

Thermal Atomic Layer Deposition (ALD) system for depositing uniform, pinhole-free thin films (2–100 nm) of oxides, nitrides, sulfides, and metals. Utilizes sequential precursor exposure with nitrogen purging. Equipped with a heated chamber, 4 precursor lines, ozone generator, and vacuum pump. Supports up to 10 × 8-inch wafers. Commonly used with AlOx and HfOx precursors to create bidirectional barrier layers for hermetic encapsulation of implantable electronic micro-devices.

A compact plasma treatment unit for cleaning, activating or slightly etching substrares at room temperature.

Multi-purpose oven for thermal treatments up to 330 °C.

A vacuum alloying furnace for baking steps up to 400 °C in a low-pressure (~10⁻¹ mbar), neutral atmosphere. It supports vacuum, nitrogen, or forming gas (H₂-N₂) environments.

Die and flip-chip bonder for the assembly of bare-die components with and accuracy of ± 5 μm.

A double-sided UV exposure unit for precise imaging of photoresist-coated PCBs. It uses powerful mercury halide lamps and vacuum hold-down to ensure uniform exposure and accurate alignment, ideal for large-format circuit boards.

Multi-purpose oven for thermal treatments up to 300 °C.