Atomic-scale bottom-up fabrication: Area-Selective Deposition (ASD) of Si-based dielectrics and its application in IC manufacturing
Translation of automotive module RF immunity test limits into equivalent IC test limits using S-parameter IC models
3D Stacked IC demonstrator using hybrid collective Die-to-Wafer bonding with copper through silicon vias (TSV)
A method for contacting a buried interconnect rail of integrated circuit chip from the back side of the IC.
Cells producing Fc containing molecules having altered glycosylation patterns and methods and use thereof
Cells producing Fc containing molecules having altered glycosylation patterns and methods and use thereof
Dense vegetation hinders sediment transport towards saltmarsh interiors - Supporting data and source code (Part I: Pre-processing)
MLR datasets of ancient Egyptian late Middle Kingdom Execration Figurines form the National Museum of Antiquities, Leiden