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PIXAPP photonics packaging pilot line development of a silicon photonic optical transceiver with pluggable fiber connectivity Ghent University
This paper demonstrates how the PIXAPP Photonics Packaging Pilot Line uses its extensive packaging capabilities across its European partner network to design and assemble a highly integrated silicon photonic-based optical transceiver. The processes used are based on PIXAPP's open access packaging design rules or Assembly Design Kit (ADK). The transceiver was designed to have the Tx and Rx elements integrated on to a single silicon photonic chip, ...
Expanding the silicon photonics portfolio with silicon nitride photonic integrated circuits Ghent University
PIXAPP Photonics Packaging Pilot Line - Development of a Silicon Photonic Optical Transceiver With Pluggable Fiber Connectivity Interuniversity Microelectronics Centre Ghent University
This paper demonstrates how the PIXAPP Photonics Packaging Pilot Line uses its extensive packaging capabilities across its European partner network to design and assemble a highly integrated silicon photonic-based optical transceiver. The processes used are based on PIXAPP's open access packaging design rules or Assembly Design Kit (ADK). The transceiver was designed to have the Tx and Rx elements integrated on to a single silicon photonic chip, ...
COMPACT INTEGRATED SILICON PHOTONIC MEMS POWER COUPLER FOR PROGRAMMABLE PHOTONICS Interuniversity Microelectronics Centre
Programmable photonics promise a plethora of optical functions while at the same time reducing the time and costs of photonic integrated circuit (PIC) development. One primary bottleneck for development of these systems is the difficulty in increasing component density because of excessive power consumption. We here present a MEMS-based Silicon Photonic power coupler that offers high optical performance (> 18 dB extinction ratio (ER), < ...
Hybrid integration of silicon photonics circuits and InP lasers by photonic wire bonding Vrije Universiteit Brussel
Towards foundry approach for silicon photonics : silicon photonics platform ePIXfab Ghent University
3D silicon photonics interposer for Tb/s optical interconnects in data centers with double-side assembled active components and integrated optical and electrical through silicon via on SOI Ghent University
In this paper, we present the concept, fabrication, process and packaging of a 3D Si photonics interposer. This Si photonics interposer merges passive photonic and electronic functionalities within a single chip. The interposer is populated with active optical and electronic add-ons, which are flip-chip bonded to the interposer using thermo-compression bonding. The interposer itself is then flip-chip bonded to a glass and Si carrier for further ...
MORPHIC: MEMS enhanced silicon photonics for programmable photonics Interuniversity Microelectronics Centre
We present our work in the European project MORPHIC to extend an established silicon photonics platform with low-power and non-volatile micro-electromechanical (MEMS) actuators to demonstrate large-scale programmable photonic integrated circuits (PICs).