A method for contacting a buried interconnect rail of integrated circuit chip from the back side of the IC. Interuniversity Microelectronics Centre
The invention is related to a method for producing an integrated circuit chip on a semiconductor device wafer, the IC comprising buried interconnect rails (15) in the front end of line and a power delivery network (PDN) on the back side of the chip. The PDN is connected to the front side by micro-sized Through Semiconductor Via (TSV) connections (16) through the thinned semiconductor wafer. Contrary to existing methods, the production of the TSVs is integrated in the process flow for fabricating the interconnect rails, with the TSVs being produced in a self-aligned manner relative to the ...