Elimination of the axial deformation problem of Cu-TSV in 3D integration

The out-of-plane expansion of Copper Through-Silicon-Via (Cu-TSV) is a concern in 3D stacking of chips, since it pushes against the BEOL, thus posing a possible reliability risk. In this study we demonstrate a solution for the Cu-TSV out-of-plane expansion problem resulting in a non-deformed BEOL. This is achieved through gaining a good understanding of the thermo-mechanical behavior of Cu by experiments and adopting this learning in our process flow. © 2010 American Institute of Physics.

ISBN:978-0-7354-0855-5

Publication year:2010

BOF-keylabel:yes

IOF-keylabel:yes

Authors from:Government, Higher Education