Infrastructure

The EVG 501 is a semi-automated wafer bonder for substrates up to 200 mm. It supports anodic, eutectic, thermocompression, and direct bonding.

A high-vacuum thermal and electron-beam evaporation system for depositing thin films of insulating, semiconducting, and metallic materials. Materials are heated resistively (via a boat) or with an electron gun until they evaporate.

Stylus profilometer for measuring surface height profiles on substrates, from hundreds of micrometers to tens of nanometers. Uses a needle probe to detect and calculate surface displacements.

A vacuum chamber designed for degassing PDMS and other casting materials. It removes air bubbles essential for elastomer molding in microfluidic and soft lithography applications.

A spin coater for uniform coating of PDMS and other materials on substrates up to 150 mm.

The Heidelberg DWL66 LDI system uses laser direct imaging (LDI) to expose photosensitive materials with resolution down to 1 μm. Laser: 250mW @ 355nm.

Microscope for inspection, image capture, and measurement of samples. Equipped with 15x oculars and a standard magnification range of 75x to 1500x.

The Kulicke & Soffa 4523 is a manual wedge bonder for aluminium and gold wire, supporting deep access and fine wire bonding (down to 18 µm). It’s ideal for applications ranging from chip-on-board to complex microwave devices, offering precise control for short, low-loop wires and deep cavity bonding.

Hot-roll laminator for bonding sample materials using heat and pressure between rotating rolls.

UV spotlight for uniform illumination of small samples, ideal for curing and related applications. Features a UV lens for a square, adjustable illumination area.