A benchtop inkjet materials printer for precise deposition of functional fluids onto a wide range of substrates. It uses disposable, user-fillable piezoelectric cartridges with 1 or 10 pL drop sizes.
Vacuum-based parylene deposition system for coating wafers and components with uniform, pinhole-free, biocompatible layers.
Reflow oven for solder pastes with a programmable temperature profile using the vapour phase of an inert liquid for the transfer of heat.
Manual mask aligner for precise UV pattern transfer onto photoresist-coated substrates in photolithography processes.
Automated assembly tool for the end seal of liquid crystal cells.
Vacuum-based setup for filling liquid crystal cells. Includes a vacuum jar with pump and meter, and a movable table that can be actuated under vacuum for precise sample handling.
Small sputter coater / evaporator to to apply thin conductive layers of gold or carbon for SEM analysis and/or EDS analysis.
Fully automatic screen printer for accurate deposition of adhesives or solder paste using either screens or stencils.
Multi-purpose quartz tube furnace with fast ramping and high-temperature capabilities. Maximum temperature: 999 °C. Ramp-up rate: up to 100 °C/min (to 800 °C). Ramp-down rate: up to 70 °C/min (from max to 600 °C). Temperature stability: ±0.2 °C above 300 °C. Nitrogen and oxygen are available as process gases.
A tungsten filament scanning electron microscope (SEM) equipped with detectors for secondary electrons, backscattered electrons, and cathodoluminescence. It enables surface imaging and elemental analysis via energy-dispersive X-ray spectroscopy (EDS)