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Researcher
Ingrid De Wolf
- Disciplines:Metallurgical engineering
Affiliations
- Structural Composites and Alloys, Integrity and Nondestructive Testing (SCALINT) (Division)
Member
From1 Aug 2020 → Today - Structural Composites and Alloys, Integrity and Nondestructive Testing (Division)
Member
From1 Jan 2012 → 31 Jul 2020 - Department of Materials Engineering (Department)
Member
From1 Oct 2007 → 31 Dec 2011
Projects
21 - 29 of 29
- Analysis of the Impact of Mechanical Stress on Three-Dimensional Memory DevicesFrom6 Nov 2017 → 7 Feb 2022Funding: Own budget, for example: patrimony, inscription fees, gifts
- Intermetallic Compound Formation in Scaled Solder Joints used for 3D Silicon-to-silicon StackingFrom27 Oct 2015 → 21 Sep 2020Funding: Own budget, for example: patrimony, inscription fees, gifts
- Electromigration Mechanics in Scaled InterconnectsFrom22 Sep 2015 → 31 Dec 2019Funding: FWO Strategic Basic Research Grant
- Nanoindentation Methodologies for Characterizing Thin (Porous) Low Dielectric Constant Materials and Copper PadsFrom13 Jul 2015 → 28 Feb 2020Funding: Own budget, for example: patrimony, inscription fees, gifts
- Exploration of GHz-Scanning Acoustic Microscopy for Failure Analysis of Innovative Silicon TechnologiesFrom30 Jun 2014 → 10 Dec 2019Funding: Own budget, for example: patrimony, inscription fees, gifts
- Thermal and electro-thermal characterization of GaN powerbarsFrom19 Jun 2013 → 21 Jun 2017Funding: BOF - Doctoral projects
- Strength and Reliability Characterization of Multi-Level Back-End-of-Line under Chip Package Interaction LoadingFrom4 Mar 2013 → 12 Dec 2017Funding: Own budget, for example: patrimony, inscription fees, gifts
- Fine Pitch 3D-Integration Using Self-Aligned AssemblyFrom2 Jul 2012 → 20 Nov 2017Funding: Own budget, for example: patrimony, inscription fees, gifts
- Investigation of In-use Stiction and Adhesion in Poly-SiGe MEMSFrom29 Sep 2008 → 3 Apr 2013Funding: Own budget, for example: patrimony, inscription fees, gifts
Publications
1 - 10 of 307
- A framework for combined simulations of electromigration induced stress evolution, void nucleation, and its dynamics: Application to nano-interconnect reliability(2023)
Authors: Ingrid De Wolf
- Electro-Absorption Modulator Thermo-Optical Self-Heating Analysis(2023)
Authors: Ingrid De Wolf
Pages: 6000 - 6006 - Degradation Mapping and Impact of Device Dimension on IGZO TFTs BTI(2023)
Authors: Ingrid De Wolf
Pages: 337 - 345 - Advanced Current-Voltage Model of Electrical Contacts to GaAs- and Ge-Based Active Silicon Photonic Devices(2023)
Authors: Ping-Yi Hsieh, Ingrid De Wolf
Pages: 4274 - 4279 - Impact of via geometry and line extension on via-electromigration in nano-interconnects(2023)
Authors: Ingrid De Wolf
Number of pages: 4 - Thermomigration-induced void formation in Cu-interconnects - Assessment of main physical parameters(2023)
Authors: Ingrid De Wolf
Number of pages: 7 - Analysis of TDDB lifetime projection in low thermal budget HfO2/SiO2 stacks for sequential 3D integrations(2023)
Authors: Andrea Vici, Ingrid De Wolf
Number of pages: 7 - Simulation of Cu pad expansion in wafer-to-wafer Cu/SiCN hybrid bonding(2022)
Authors: Marc Seefeldt, Ingrid De Wolf
- Impact of Externally Induced Local Mechanical Stress on Electrical Performance of Decananometer MOSFETs(2022)
Authors: Ingrid De Wolf
Pages: 5382 - 5385 - Properties of ultrathin molybdenum films for interconnect applications(2022)
Authors: Johan Meersschaut, Joris Van de Vondel, Ingrid De Wolf
Patents
1 - 9 of 9
- Method for the electrical bonding of semiconductor components (Inventor)
- A method for the electrical bonding of semiconductor components (Inventor)
- Method of detecting manufacturing defects by thermal stimulation (Inventor)
- Method for aligning micro-electronic components using an alignment liquid and electrostatic alignment as well as corresponding assembly of aligned micro-electronic components (Inventor)
- Method for aligning micro-electronic components (Inventor)
- Method for aligning micro-electronic components (Inventor)
- Method for producing an integrated circuit device with enhanced mechanical properties (Inventor)
- Lock in thermal laser stimulation through one side of the device while acquiring lock-in thermal emission images on the opposite side (Inventor)
- Lock in thermal laser stimulation through one side of the device while acquiring lock-in thermal emission images on the opposite side (Inventor)