On the increase of intermetallic compound's thickness at the cold side in liquid Sn and SnAg solders under thermal gradient (vol 172, pg 211, 2016)

Korte inhoud:© 2018 Elsevier B.V. The authors would like to inform that on page 212 of the article, there is a typographical error in Eq. (1). [Formula presented]where, kth is the thermal conductivity of the solder material, and T is the temperature in kelvin. In Eq. (a), [Formula presented]is missing in the left side of [Formula presented]. The correct form of the partial differential equation (PDE) for variation of T within the solder domain, and that has been actually solved in the original manuscript, should be the Laplacian of the scalar variable T: [Formula presented] As the FEA based calculation within MOOSE framework for description of temperature distribution, in context of the original manuscript, was performed utilizing MatDiffusion kernel with “T” variable (https://github.com/anilkunwar/danphe/tree/working_codes/examples/Thermomigration), the accuracy of the numerical results and subsequent inferences in the manuscript, are not affected by the presence of the abovementioned typographical error. Within MOOSE, the MatDiffusion kernel represents the Laplacian of a general scalar variable. Thus, the use of this kernel within the input files for the FEM based calculation of the original manuscript, automatically implied the solution of Eq. (b) therein. The authors would like to apologize for the inconvenience caused.

Jaar van publicatie:2018

Trefwoorden:Materiaalkunde, Toegepaste natuurkunde