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Onderzoeker
Chukwudi Okoro
- Disciplines:Controlesystemen, robotica en automatisatie, Ontwerptheorieën en -methoden, Mechatronica en robotica, Computertheorie, Productietechnieken, Andere mechanische en productie ingenieurswetenschappen, Productontwikkeling
Affiliaties
- Afdeling Productietechnieken, Machinebouw en Automatisering (Afdeling)
Lid
Vanaf1 apr 2006 → 30 sep 2010
Publicaties
1 - 9 van 9
- A novel Cu-Cu bonding technique: the insertion bonding approach(2011)
Auteurs: Chukwudi Okoro, Dirk Vandepitte
Pagina's: 1885 - 1894 - Polymer filling of silicon trenches for 3D through silicon vias applications(2011)
Auteurs: Chukwudi Okoro
Pagina's: 825 - 832 - Influence of annealing conditions on the mechanical and microstructural behavior of electroplated Cu-TSV(2010)
Auteurs: Chukwudi Okoro, Bert Verlinden, Dirk Vandepitte
Pagina's: 1 - 6 - Test structures for characterization of thermal-mechanical stress in 3D stacked IC for analog design(2010)
Auteurs: Yu Yang, Chukwudi Okoro, Michal Rakowski
Pagina's: 140 - 144 - Impact of thinning and through silicon via proximity on high-k / metal gate first CMOS performance(2010)
Auteurs: Yu Yang, Guruprasad Katti, Chukwudi Okoro, Panagiotis Asimakopoulos, Ingrid De Wolf
Pagina's: 109 - 110 - Elimination of the axial deformation problem of Cu-TSV in 3D integration(2010)
Auteurs: Chukwudi Okoro, Dirk Vandepitte
Pagina's: 214 - 220 - Insertion bonding: A novel Cu-Cu bonding approach for 3D integration(2010)
Auteurs: Chukwudi Okoro, Dirk Vandepitte
Pagina's: 1370 - 1375 - Comprehensive analysis of the impact of single and arrays of through silicon vias induced stress on high-k / metal gate CMOS performances
Auteurs: Ingrid De Wolf, Panagiotis Asimakopoulos, Chukwudi Okoro, Yu Yang
Pagina's: 26 - 29 - Extraction of the appropriate material property for realistic modeling of through-Silicon-vias using µ-Raman spectroscopy
Auteurs: Chukwudi Okoro, Yu Yang, Dirk Vandepitte, Bert Verlinden, Ingrid De Wolf
Pagina's: 16 - 18