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Octrooi
A pre-treatment method to increase copper island density and to improve adhesion for cu on barrier layers
The present invention is related to a method for producing on-chip interconnect structures on a substrate, comprising at least the steps of : - Providing a substrate and depositing a Ruthenium-comprising layer on top of said substrate, and then - Performing a pre-treatment of the Ru-comprising layer electrochemically with an HBF 4 -based electrolyte, and then - Performing electrochemical deposition of copper onto the pre-treated Ru-comprising layer.
Octrooi-publicatienummer: EP2244287
Jaar aanvraag: 2018
Jaar toekenning: 2018
Jaar van publicatie: 2018
Status: Toegewezen
URI: link to Espacenet
Technologiedomeinen: Semiconductoren, Oppervlaktetechniek, coating
Gevalideerd voor IOF-sleutel: Ja
Toegewezen aan: Associatie KULeuven