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EMC-signatures of microcontrollers under thermal stress analyzed by FSV
Boekbijdrage - Boekhoofdstuk Conferentiebijdrage
The EMC-signature of devices containing microcontrollers can differ due to thermal or mechanical stress. Research is presented to prove the feature selective validation method (FSV) to be sensitive enough to analyze differences in signatures.
Boek: 8th international workshop on electromagnetic compatibility of integrated circuits, Proceedings
Aantal pagina's: 1