Optimized selection of materials for IGBT module packaging

This paper examines the impact of various packaging materials on the IGBT module's thermal characteristics. A 3D finite element method (FEM) model of the studied IGBT module is created and validated by experimental tests. The materials used in the baseplate and the insulation layer of the IGBT module are then replaced with various materials to investigate how different material combinations affect the thermal performance. The ob-tained thermal performance of different materials is placed next to other criteria (mechanical strengths, least square of CTE mismatches, cost, and weight) to be ranked by the TOPSIS multi-criteria decision-making method based on the given objective weights. The results showed that the three combinations of AlSiC/AlN, W/Si3N4 and AlSiC/Si3N4 have the best overall performance and are ranked first to third, respectively. The frequently used material pair Cu/Al2O3 achieved 14th place indicating that it performs poorly in comparison to the other alternatives.

Jaar van publicatie:2022

Trefwoorden:TOPSIS, Reliability of power electronics, IGBT module, Finite element method, Thermal model

Toegankelijkheid:Embargoed