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Researcher
Guruprasad Katti
- Disciplines:Nanotechnology, Design theories and methods
Affiliations
- Assiocated Division ESAT-INSYS (INSYS), Integrated Systems (Division)
Member
From1 Aug 2020 → 31 May 2011 - Associated Section of ESAT - INSYS, Integrated Systems (Division)
Member
From15 Mar 2011 → 31 May 2011 - Department of Electrical Engineering (ESAT) (Department)
Member
From8 Jan 2007 → 14 Mar 2011
Publications
11 - 12 of 12
- 3D stacked IC demonstration using a through silicon via first approach
Authors: Guruprasad Katti, Wim Dehaene
Pages: 603 - 606 - Capacitance reduction technique for through silicon via (TSV) in p-Si substrate
Authors: Guruprasad Katti, Kristin De Meyer, Wim Dehaene
Pages: 549 - 551