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Researcher
Ingrid De Wolf
- Disciplines:Metallurgical engineering
Affiliations
- Structural Composites and Alloys, Integrity and Nondestructive Testing (SCALINT) (Division)
Member
From1 Aug 2020 → Today - Structural Composites and Alloys, Integrity and Nondestructive Testing (Division)
Member
From1 Jan 2012 → 31 Jul 2020 - Department of Materials Engineering (Department)
Member
From1 Oct 2007 → 31 Dec 2011
Projects
1 - 10 of 29
- Developing Tip-Enhanced Raman Spectroscopy for advanced nanoelectronicsFrom1 Mar 2022 → TodayFunding: Own budget, for example: patrimony, inscription fees, gifts
- Design-Technology Co-optimization techniques for enablement of MRAM-based Machine Learning hardwareFrom18 Feb 2022 → 31 May 2022Funding: Own budget, for example: patrimony, inscription fees, gifts
- Characterization of IMC (intermetallic compound) properties used at 3D stacking high density interconnectsFrom21 Jan 2022 → TodayFunding: Own budget, for example: patrimony, inscription fees, gifts
- Machine learning opportunities for reliability researchFrom23 Dec 2021 → TodayFunding: Own budget, for example: patrimony, inscription fees, gifts
- Electron-beam based nanoprobing for failure and defect analysis of sub-10 nm node semiconductor devicesFrom23 Dec 2021 → TodayFunding: Own budget, for example: patrimony, inscription fees, gifts
- Investigation of void dynamics in metal interconnects under electrical mechanical thermal stimuli using physics based models augmented by machine learningFrom22 Nov 2021 → TodayFunding: Own budget, for example: patrimony, inscription fees, gifts
- Reliability of Monolithic Integrated III-V Laser DevicesFrom22 Sep 2021 → TodayFunding: Own budget, for example: patrimony, inscription fees, gifts
- Reliability of thin-film IGZO transistors for logic and memory applicationsFrom22 Sep 2021 → TodayFunding: FWO Strategic Basic Research Grant
- Understanding defect generation/recombination processes in Ge-on-Si photodetectorsFrom22 Sep 2021 → TodayFunding: Own budget, for example: patrimony, inscription fees, gifts
- Active coolant flow control for energy-efficient integrated package level micro-jet coolingFrom7 Jun 2021 → TodayFunding: Own budget, for example: patrimony, inscription fees, gifts
Publications
31 - 40 of 307
- Study of the effect of Sn grain boundaries on IMC morphology in solid state inter-diffusion soldering(2019)
Authors: Lin Hou, Nele Moelans, Ingrid De Wolf
- Experimental Characterization of a Chip-Level 3-D Printed Microjet Liquid Impingement Cooler for High-Performance Systems(2019)
Authors: Tiwei Wei, shoufeng Yang, Ingrid De Wolf, Tine Baelmans
Pages: 1815 - 1824 - Study of out-of-plane mechanical stress impact on Si BJT and diffusion resistor using in-situ nanoindentation probing(2019)
Authors: Hesheng Lin, Ingrid De Wolf
- A novel electromigration characterization method based on low-frequency noise measurements(2019)
Authors: Sofie Beyne, Ingrid De Wolf
- Impact of Mechanical Stress on the Electrical Performance of 3D NAND(2019)
Authors: Anastasiia Kruv, Ingrid De Wolf
Number of pages: 5 - New Access to Soft Breakdown Parameters of Low-k Dielectrics Through Localisation-Based Analysis(2019)
Authors: Ingrid De Wolf
Number of pages: 9 - Low-frequency noise and defects in copper and ruthenium resistors(2019)
Authors: Sofie Beyne, Ingrid De Wolf
- Experimental characterization and model validation of liquid jet impingement cooling using a high spatial resolution and programmable thermal test chip(2019)
Authors: Tiwei Wei, Ingrid De Wolf, Tine Baelmans
Pages: 308 - 318 - Study of the mechanical stress impact on silicide contact resistance by 4-point bending(2019)
Authors: Anastasiia Kruv, Ingrid De Wolf
Number of pages: 5 - Low-Frequency Noise Measurements to Characterize Cu-Electromigration down to 44nm Metal Pitch(2019)
Authors: Sofie Beyne, Ingrid De Wolf
Number of pages: 6
Patents
1 - 9 of 9
- Method for the electrical bonding of semiconductor components (Inventor)
- A method for the electrical bonding of semiconductor components (Inventor)
- Method of detecting manufacturing defects by thermal stimulation (Inventor)
- Method for aligning micro-electronic components using an alignment liquid and electrostatic alignment as well as corresponding assembly of aligned micro-electronic components (Inventor)
- Method for aligning micro-electronic components (Inventor)
- Method for aligning micro-electronic components (Inventor)
- Method for producing an integrated circuit device with enhanced mechanical properties (Inventor)
- Lock in thermal laser stimulation through one side of the device while acquiring lock-in thermal emission images on the opposite side (Inventor)
- Lock in thermal laser stimulation through one side of the device while acquiring lock-in thermal emission images on the opposite side (Inventor)